Here is the latest update if for some reason you cannot view it on Kickstarter.
We've made great progress with this delayed near-final prototype and we wanted to share the images with you in this interim update.
They say a picture paints a thousand words..
Here is the start of the process, this is the PCB panel being stencilled with solder paste. This machine squeezes the correct amount of solder through a highly polished, laser cut metal stencil. http://openvizsla.org/production_ud/paste_printing.png
After the stencilling is completed and the solder placement has been checked the board it sent over to the machine that places the components on the board.
Here are the majority of the components placed into that "pick and place" machine.http://openvizsla.org/production_ud/components.png
The machine has a file with the coordinates of each component that needs to be placed onto the panel. The component is picked from the reels and then placed onto the board at incredibly high speed. http://www.youtube.com/watch?v=FUy_efV6OcE
The panel with placed parts.http://openvizsla.org/production_ud/placed_parts.png
Once the placement is complete then the board is again checked and goes into the vapour phase soldering machine. http://openvizsla.org/production_ud/vavour_phase_soldering.png
This machine uses condensation heating, reflow is achieved by sitting within a layer of saturated vapour that causes the solder paste to melt.
Here are the settings just before it starts the reflow process.http://openvizsla.org/production_ud/soldering_display.png
Here is a video of this process.http://www.youtube.com/watch?v=BDegfybAF7M
Once the board is completed the components are visually checked (using a microscope) and then they move onto X-ray inspection.
This is the X-ray inspection of the FPGA http://openvizsla.org/production_ud/fpga_xray.jpg
This has been placed and soldered near perfectly (there will be some slight adjustments to the ground pad vias and solder paste so that we get even more uniformly reflowed solder there (but this certainly isn't a show stopper).
Here you can see a close up of the "via in pad" that is used to breakout some of the signals from the incredibly small FPGA.http://openvizsla.org/production_ud/via_in_pad_xray.jpg
And here is the X-ray of the XMOS part (you can even see bond-wires onto the actual silicon inside the chip package!)http://openvizsla.org/production_ud/xmos_xray.jpg
The X-ray machine is able to check the actual solder joins on a part using 3D X-ray techniques, here is an image of the USB PHY part, you can see the part itself, copper tracks, vias and other passive components nearby. This machine is amazing and really helps with checking for any hidden physical problems related to the board.http://openvizsla.org/production_ud/usb_phy_xray.jpg
Once all that is done the PTH (plated through-hole) components are added (USB connectors etc) and the units are removed from the panel.
We hope you will agree that this has been worth the wait.http://openvizsla.org/production_ud/ov2_1.pnghttp://openvizsla.org/production_ud/ov2_2.png
The OpenVizsla board placed on top of a Credit Card.
This board will be tested over the next few days and assuming all is well, this will move onto serial production very soon.
More updates to follow over the coming days!
In few words: I'm not sure they will be able to deliver what they promised...