Sorta looks like a university thesis project, if you were somewhat into electronics you would already know that it is a current transformer with a load built in hence the 1V output.
A split core type is more calculations compared to a non-split.
You want help with something let the users on sonsivri do all the guessing and figuring stuff out!
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61
on: July 23, 2025, 08:33:45 20:33
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| Started by safkans - Last post by sphinx | ||
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62
on: July 23, 2025, 07:40:43 19:40
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| Started by safkans - Last post by Sideshow Bob | ||
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In what range of current do you want to measure is it AC or DC. I also see you only have two posts. How well are you into the arts of electronics. Just so I can adjust how I/We may help you
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63
on: July 23, 2025, 07:24:51 19:24
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| Started by safkans - Last post by safkans | ||
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If you're familiar with the SCT-013 series sensors, I'd like to build an equivalent sensor myself. How should I proceed? I'd appreciate your advice.
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64
on: July 21, 2025, 11:25:27 23:25
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65
on: July 17, 2025, 11:40:00 23:40
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| Started by Rego - Last post by Vineyards | ||
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Didn't have any luck with any of these CAD apps. Solid Edge has a free community version. I'm using it now, and the results are quite promising. I am giving up on Fusion 360 after the recent policy changes forced non-commercial users to pay a license fee. I'm not earning a penny using this software. I thought there would be a free edition for enthusiasts, and all of a sudden, the rules have changed. Sorry about the inconvenience, users, you can do whatever you want with the now-useless designs you created over three or so years.
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66
on: July 17, 2025, 11:30:57 23:30
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| Started by pushycat - Last post by Vineyards | ||
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It is normal to assume that different resin types were used on your PCBs. No-clean types can leave a residue when cleaned with IPA. The water content threshold for IPA can be as high as 30%. The so-called pure IPA used in electronics can have a water content of up to 1%. The purer the alcohol, the more prone it is to evaporation. If the cap of the IPA container is left open, the water content may reach approximately 2% after one hour, depending on the humidity and temperature of your room. Each passing hour will add another 1%. That of course, renders it unfit for delicate cleaning as the water content will cause corrosion (oxidation) on metals, and cause contamination, which is unacceptable for RF or High Z circuitry.
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67
on: July 17, 2025, 08:58:38 08:58
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| Started by WangONC - Last post by WangONC | ||
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Thank you for invitation. Registration is done.
Note: This message sent by the system behalf of WangONC. |
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68
on: July 17, 2025, 08:38:50 08:38
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| Started by WangONC - Last post by hosmis | ||
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This member is invited by me. Registration isn't completed yet.
Note: This message sent by the system behalf of hosmis. |
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69
on: July 17, 2025, 08:08:44 08:08
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70
on: July 14, 2025, 11:35:21 23:35
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| Started by 8051-ARM - Last post by 8051-ARM | ||
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STM32CubeMX-Win new version Version 6.15.0
Quote We are pleased to announce that the version 6.15.0 of STM32CubeMX is available. What is new in 6.15.0: Enhanced microprocessor support: Added the STM32MP21-A35-TD, STM32MP21-M33-TD, STM32MP25-M33-TD, and STM32MP23-M33-TD trusted domains for the STM32MP2 MPUs and their Arm® Cortex®-A35 and Cortex®-M33 processors. Integrated the STARM-Clang toolchain: The STMicroelectronics LLVM-based toolchain for Arm®, STARM-Clang, leverages Clang's modular architecture for faster compilation and enhanced support for modern language standards, expanding the build capabilities. Build process enhancements: Use of CMake for more efficient project compilation. Removal of the -Wpedantic and -Wextra options from CMake GCC toolchain template to match the build results produced by STM32CubeIDE. Updated the RIF feature implementation: Integrated the RIF feature for STM32MP2 microprocessors with the STM32MP21-A35-TD, STM32MP21-M33-TD, STM32MP25-M33-TD, and STM32MP23-M33-TD trusted domains. Updated software download management: Added pause and resume functionalities to the software package download feature. Updated the IAR Embedded Workbench® for Arm® toolchain (EWARM) support: Added the support for STM32MP13xx microprocessors. Updated the pin-to-pin compatibility: Implemented the pinout compatibility for STM32MP2 microprocessors. Added the wM-Bus middleware: Implemented the wM-Bus PHY middleware for STM32WL33xx microcontrollers. Updated the memory management tool (MMT): Implemented memory management for the STM32U3. Upgrade Azure RTOS [USBX ,LevelX ,FileX ,ThreadX] 6.2.0 to 6.4.0 for STM32WBA6. Upgraded the JxBrowser version to V8.5.0. Main fixed issues in 6.15.0: Refer to the STM32 microcontroller wiki at: https://wiki.st.com/stm32mcu/wiki/STM32CubeMX_errata_6.15.x Known problems and limitations in 6.15.0: Refer to the STM32 microcontroller wiki at: https://wiki.st.com/stm32mcu/wiki/STM32CubeMX_errata_6.15.x How to get STM32CubeMX 6.15.0: Under this link Or update your current installation of STM32CubeMX using: Help > Check for Updates |
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